Patent Assignment Details
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Reel/Frame: | 021245/0511 | |
| Pages: | 2 |
| | Recorded: | 07/01/2008 | | |
Attorney Dkt #: | 2007-035US8 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12217217
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Filing Dt:
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07/01/2008
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Publication #:
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Pub Dt:
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01/07/2010
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Title:
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Through-substrate vias and method of fabricating same
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Assignee
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P.O. BOX 1085, MAIL CODE A15 |
THOUSAND OAKS, CALIFORNIA 91358-0085 |
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Correspondence name and address
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STEVEN C. PATRICK
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KOPPEL, PATRICK, HEYBL & DAWSON
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555 ST. CHARLES DRIVE, SUITE 107
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THOUSAND OAKS, CA 91360
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