Patent Assignment Details
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Reel/Frame: | 013222/0514 | |
| Pages: | 4 |
| | Recorded: | 11/05/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10065630
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Filing Dt:
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11/05/2002
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Publication #:
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Pub Dt:
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09/04/2003
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Title:
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Bond pad and process for fabricating the same
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Assignee
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NO. 16, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7 FLOOR-1, NO. 100
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ROOSEVELT ROAD, SECTION 2
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TAIPEI, TAIWAN 100
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