Patent Assignment Details
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Reel/Frame: | 010897/0515 | |
| Pages: | 2 |
| | Recorded: | 06/15/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/02/2003
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Application #:
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09572007
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Filing Dt:
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05/16/2000
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Publication #:
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Pub Dt:
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02/06/2003
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Title:
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SEMICONDUCTOR-SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING IT
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Assignees
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2-1 NIHONBASHI-MUROMACHI 2-CHOME |
CHUO-KU, TOKYO 103-8666, JAPAN |
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1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU |
KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN |
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Correspondence name and address
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SCHNADER HARRISON SEGAL & LEWIS
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AUSTIN R. MILLER
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IP DEPARTMENT
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1600 MARKET STREET, 36TH FLOOR
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PHILADELPHIA, PA 19103
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