Patent Assignment Details
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Reel/Frame: | 051743/0515 | |
| Pages: | 17 |
| | Recorded: | 02/06/2020 | | |
Attorney Dkt #: | G686.105.101 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16623618
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Filing Dt:
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12/17/2019
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Publication #:
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Pub Dt:
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06/25/2020
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Title:
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LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS
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Assignee
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HERAEUSSTRASSE 12-14 |
HANAU, GERMANY 63450 |
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Correspondence name and address
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DICKE, BILLIG & CZAJA
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FIFTH STREET TOWERS
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100 SOUTH FIFTH STREET, SUITE 2250
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MINNEAPOLIS, MN 55402
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09/20/2024 09:56 AM
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