Patent Assignment Details
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| Reel/Frame: | 055152/0515 | |
| Pages: | 17 |
| | Recorded: | 02/04/2021 | | |
| Attorney Dkt #: | 3570-722 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/28/2024
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Application #:
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17266023
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Filing Dt:
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02/04/2021
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Publication #:
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Pub Dt:
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09/23/2021
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Title:
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ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION AND ADHESIVE FILM CONTAINING THE SAME
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Assignee
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| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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Correspondence name and address
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ROTHWELL, FIGG, ERNST & MANBECK, P.C.
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607 14TH ST NW STE 800
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WASHINGTON, DC 20005
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06/18/2024 01:36 AM
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