Patent Assignment Details
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Reel/Frame: | 013308/0517 | |
| Pages: | 3 |
| | Recorded: | 07/21/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/28/2004
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Application #:
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10169982
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Filing Dt:
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07/12/2002
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Publication #:
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Pub Dt:
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01/02/2003
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Title:
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CHIP MOUNTING METHOD
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Assignee
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MITSUI BLDG. 2-GOKAN, 4-18 NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI |
OSAKA, JAPAN 530-0005 |
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Correspondence name and address
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SMITH PATENT OFFICE
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RANDOLPH A. SMITH
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1901 PENNSYLVANIA AVE., N.W.
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SUITE 200
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WASHINGTON, D.C. 20006-3433
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