Patent Assignment Details
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| Reel/Frame: | 068679/0517 | |
| Pages: | 6 |
| | Recorded: | 09/24/2024 | | |
| Attorney Dkt #: | 1111-017245-US(PAR) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18894114
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Filing Dt:
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09/24/2024
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Publication #:
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Pub Dt:
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05/01/2025
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Title:
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LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE LEAD FRAME
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Assignee
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| 726, UNGNAM-RO, SEONGSAN-GU, CHANGWON-SI |
| GYEONGSANGNAM-DO, KOREA, REPUBLIC OF 51552 |
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Correspondence name and address
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JANIK J MARCOVICI
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99 HAWLEY LANE
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STRATFORD, CT 06614
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06/26/2025 01:49 PM
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