Patent Assignment Details
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Reel/Frame: | 016670/0518 | |
| Pages: | 3 |
| | Recorded: | 06/09/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11068255
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Filing Dt:
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02/28/2005
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Publication #:
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Pub Dt:
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02/09/2006
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Title:
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Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints
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Assignee
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1001 TA HSUEH ROAD |
HSINCHU, TAIWAN R.O.C. |
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Correspondence name and address
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BUCKNAM AND ARCHER
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1077 NORTHERN BOULEVARD
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ROSLYN, NY 11576
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