Patent Assignment Details
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Reel/Frame: | 024182/0518 | |
| Pages: | 5 |
| | Recorded: | 04/02/2010 | | |
Attorney Dkt #: | ASEG-025/00US 307632-2045 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12753843
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Filing Dt:
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04/02/2010
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Publication #:
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Pub Dt:
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10/06/2011
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Title:
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Stacked Semiconductor Device Package Assemblies with Reduced Wire Sweep and Manufacturing Methods Thereof
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Assignee
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26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
KAOSIUNG (R.O.C.), TAIWAN |
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Correspondence name and address
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COOLEY GODWARD KRONISH LLP
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777 - 6TH STREET NW, SUITE 1100
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JASON C. FAN / HN
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WASHINGTON, DC 20001
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06/22/2024 04:16 PM
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