Patent Assignment Details
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Reel/Frame: | 017365/0519 | |
| Pages: | 3 |
| | Recorded: | 12/19/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/03/2008
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Application #:
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11313435
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Filing Dt:
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12/19/2005
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Publication #:
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Pub Dt:
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03/01/2007
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Title:
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CHIP PACKAGE AND BUMP CONNECTING STRUCTURE THEREOF
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Assignee
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8F, NO. 535, CHUNG-CHENG RD. |
HSIN-TIEN CITY, TAIPEI HSIEN, TAIWAN R.O.C. |
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Correspondence name and address
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J.C. PATENTS, INC.
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4 VENTURE, SUITE 250
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IRVINE, CA 92618
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