Patent Assignment Details
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Reel/Frame: | 010529/0520 | |
| Pages: | 2 |
| | Recorded: | 01/24/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09490705
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Filing Dt:
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01/24/2000
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Publication #:
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Pub Dt:
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11/28/2002
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Title:
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Semiconductor device and a method for forming a via hole in a semiconductor device
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Assignee
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7-1, SHIBA 5-CHOME, MINATO-KU |
TOKYO, JAPAN |
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Correspondence name and address
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HELFGOTT & KARAS, P.C.
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AARON B. KARAS
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EMPIRE STATE BUILDING
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350 5TH AVENUE, SUITE 6024
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NEW YORK, NY 10118
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