Patent Assignment Details
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| Reel/Frame: | 005168/0522 | |
| Pages: | 5 |
| | Recorded: | 10/23/1989 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/24/1991
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Application #:
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07398239
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Filing Dt:
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08/25/1989
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Title:
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PROCESS FOR REMOVING DEPOSITS FROM BACKSIDE AND END EDGE OF SEMICONDUCTOR WAFER WHILE PREVENTING REMOVAL OF MATERIALS FROM FRONT SURFACE OF WAFER
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Assignee
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| 3050 BOWERS AVENUE |
| A CORP. OF DE |
| SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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PAUL L. HICKMAN
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APPLIED MATERIALS, INC.
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3050 BOWERS AVE.
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SANTA CLARA, CA 95054
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