Patent Assignment Details
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| Reel/Frame: | 040903/0522 | |
| Pages: | 3 |
| | Recorded: | 01/09/2017 | | |
| Attorney Dkt #: | 18506-1077 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/10/2019
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Application #:
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15356368
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Filing Dt:
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11/18/2016
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Publication #:
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Pub Dt:
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05/24/2018
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Title:
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METHOD OF SEMICONDUCTOR WAFER BONDING AND SYSTEM THEREOF
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Assignee
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
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2301 DUPONT DR. SUITE 510
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IRVINE, CA 92612
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