Patent Assignment Details
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| Reel/Frame: | 023877/0523 | |
| Pages: | 3 |
| | Recorded: | 02/01/2010 | | |
| Attorney Dkt #: | 5649-2635 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12696942
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Filing Dt:
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01/29/2010
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Publication #:
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Pub Dt:
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08/05/2010
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Title:
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MULTI-CHIP STACKED SEMICONDUCTOR DEVICES HAVING RESPECTIVE CHIPS PADS COUPLED TO CONDUCTIVE VIAS AND METHODS OF FORMING THE SAME
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Assignee
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| 416 MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI |
| GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF |
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Correspondence name and address
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MYERS BIGEL SIBLEY & SAJOVEC, P.A./KSC
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4140 PARKLAKE AVE.
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SUITE 600
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RALEIGH, NC 27612
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