Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 032303/0523 | |
| Pages: | 4 |
| | Recorded: | 02/26/2014 | | |
| Attorney Dkt #: | L13-1423US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14190659
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Filing Dt:
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02/26/2014
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Publication #:
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Pub Dt:
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08/27/2015
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Title:
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Method for Flip-Chip Bonding Using Copper Pillars
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Assignee
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| 1320 RIDDER PARK DRIVE |
| SAN JOSE, CALIFORNIA 95131 |
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Correspondence name and address
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IP LEGAL SERVICES
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1500 EAST LANCASTER AVENUE, SUITE 100
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P.O. BOX 1027
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PAOLI, PA 19301
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05/29/2024 02:31 PM
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