Total properties:
26
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Patent #:
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Issue Dt:
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05/06/2003
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Application #:
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10040455
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Filing Dt:
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01/09/2002
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Publication #:
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Pub Dt:
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07/11/2002
| | | | |
Title:
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INKJET DEVICE ENCAPSULATED AT THE WAFER SCALE
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Patent #:
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Issue Dt:
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07/27/2004
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Application #:
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10040456
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Filing Dt:
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01/09/2002
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Publication #:
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Pub Dt:
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07/11/2002
| | | | |
Title:
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MOLDS FOR WAFER SCALE MOLDING OF PROTECTIVE CAPS
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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10040473
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Filing Dt:
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01/09/2002
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Publication #:
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Pub Dt:
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07/11/2002
| | | | |
Title:
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LIGHT EMITTING SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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06/15/2004
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Application #:
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10129499
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Filing Dt:
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05/06/2002
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Publication #:
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Pub Dt:
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05/15/2003
| | | | |
Title:
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USE OF PROTECTIVE CAPS AS MASKS AT A WAFER SCALE
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Patent #:
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Issue Dt:
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09/27/2005
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Application #:
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10129500
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Filing Dt:
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05/06/2002
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Publication #:
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Pub Dt:
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05/15/2003
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Title:
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USE OF INFRARED RADIATION IN MOLDING OF PROTECTIVE CAPS
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Patent #:
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Issue Dt:
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03/21/2006
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Application #:
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10129504
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Filing Dt:
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05/06/2002
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Publication #:
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Pub Dt:
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05/15/2003
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Title:
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MOLDING ASSEMBLY FOR WAFER SCALE MOLDING OF PROTECTIVE CAPS
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Patent #:
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Issue Dt:
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08/17/2004
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Application #:
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10129505
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Filing Dt:
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05/06/2002
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Publication #:
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Pub Dt:
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07/03/2003
| | | | |
Title:
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ACCELEROMETER PROTECTED BY CAPS APPLIED AT THE WAFER SCALE
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Patent #:
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Issue Dt:
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08/02/2005
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Application #:
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10250967
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Filing Dt:
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07/10/2003
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Publication #:
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Pub Dt:
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04/29/2004
| | | | |
Title:
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INKJET DEVICE ENCAPSULATED AT THE WAFER SCALE
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Patent #:
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Issue Dt:
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11/22/2005
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Application #:
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10466059
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Filing Dt:
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07/10/2003
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Publication #:
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Pub Dt:
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05/27/2004
| | | | |
Title:
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LIGHT EMITTING SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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03/22/2005
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Application #:
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10466060
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Filing Dt:
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07/10/2003
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Publication #:
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Pub Dt:
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04/22/2004
| | | | |
Title:
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WAFER SCALE FIBER OPTIC TERMINATION
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Patent #:
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Issue Dt:
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01/31/2006
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Application #:
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10466072
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Filing Dt:
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07/10/2003
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Publication #:
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Pub Dt:
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03/18/2004
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Title:
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MOLDS FOR WAFER SCALE MOLDING OF PROTECTIVE CAPS
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Patent #:
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Issue Dt:
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12/27/2005
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Application #:
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10728798
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Filing Dt:
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12/08/2003
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Publication #:
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Pub Dt:
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04/29/2004
| | | | |
Title:
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CHIP WITH MOLDED CAP ARRAY
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Patent #:
|
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Issue Dt:
|
11/02/2004
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Application #:
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10728799
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Filing Dt:
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12/08/2003
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Publication #:
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Pub Dt:
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04/29/2004
| | | | |
Title:
|
MOLDED WAFER SCALE CAP
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Patent #:
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|
Issue Dt:
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12/20/2005
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Application #:
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10728800
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Filing Dt:
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12/08/2003
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Publication #:
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Pub Dt:
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04/29/2004
| | | | |
Title:
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WAFER SCALE CAPS LOCATED BY MOLDING
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|
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Patent #:
|
|
Issue Dt:
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10/24/2006
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Application #:
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10728808
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Filing Dt:
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12/08/2003
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Publication #:
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Pub Dt:
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04/29/2004
| | | | |
Title:
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TWO PART MOLD FOR WAFER SCALE CAPS
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Patent #:
|
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Issue Dt:
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04/11/2006
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Application #:
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10728923
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Filing Dt:
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12/08/2003
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Publication #:
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|
Pub Dt:
|
04/29/2004
| | | | |
Title:
|
MOLD MAKING METHOD FOR WAFER SCALE CAPS
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|
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Patent #:
|
|
Issue Dt:
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01/24/2006
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Application #:
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10728929
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Filing Dt:
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12/08/2003
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Publication #:
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Pub Dt:
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05/27/2004
| | | | |
Title:
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CHIPS WITH WAFER SCALE CAPS FORMED BY MOLDING
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Patent #:
|
|
Issue Dt:
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01/03/2006
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Application #:
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10728930
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Filing Dt:
|
12/08/2003
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Publication #:
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|
Pub Dt:
|
04/29/2004
| | | | |
Title:
|
MOLDED WAFER SCALE CAP ARRAY
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|
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Patent #:
|
|
Issue Dt:
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02/21/2006
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Application #:
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10791840
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Filing Dt:
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03/04/2004
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Publication #:
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Pub Dt:
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09/02/2004
| | | | |
Title:
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METHOD OF PROTECTING MICROFABRICATED DEVICES WITH PROTECTIVE CAPS
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Patent #:
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Issue Dt:
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04/12/2005
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Application #:
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10853175
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Filing Dt:
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05/26/2004
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Publication #:
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Pub Dt:
|
11/04/2004
| | | | |
Title:
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METHOD OF MANUFACTURING A LIGHT EMITTING SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
08/09/2005
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Application #:
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10893376
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Filing Dt:
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07/19/2004
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Publication #:
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Pub Dt:
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12/23/2004
| | | | |
Title:
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PACKAGED ACCELEROMETER
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Patent #:
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Issue Dt:
|
11/17/2009
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Application #:
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10898214
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Filing Dt:
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07/26/2004
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Publication #:
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Pub Dt:
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12/30/2004
| | | | |
Title:
|
METHOD FOR WAFER SCALE MOLDING OF PROTECTIVE CAPS
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|
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Patent #:
|
|
Issue Dt:
|
03/07/2006
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Application #:
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10949350
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Filing Dt:
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09/27/2004
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Publication #:
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Pub Dt:
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02/24/2005
| | | | |
Title:
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METHOD OF FABRICATING AN ARRAY OF WAFER SCALE POLYMERIC CAPS
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|
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Patent #:
|
|
Issue Dt:
|
08/22/2006
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Application #:
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10986362
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Filing Dt:
|
11/12/2004
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Publication #:
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Pub Dt:
|
05/05/2005
| | | | |
Title:
|
OPTICAL FIBER TERMINATOR PACKAGE
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|
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Patent #:
|
|
Issue Dt:
|
08/05/2008
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Application #:
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11064005
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Filing Dt:
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02/24/2005
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Publication #:
|
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Pub Dt:
|
06/30/2005
| | | | |
Title:
|
METHOD FOR FORMING AT LEAST ONE PROTECTIVE CAP
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|
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Patent #:
|
|
Issue Dt:
|
10/23/2007
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Application #:
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11064006
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Filing Dt:
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02/24/2005
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Publication #:
|
|
Pub Dt:
|
06/30/2005
| | | | |
Title:
|
MOULDING ASSEMBLY FOR FORMING AT LEAST ONE PROTECTIVE CAP
|
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