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Patent Assignment Details
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Reel/Frame:022717/0524   Pages: 2
Recorded: 05/21/2009
Attorney Dkt #:105290.61524US
Conveyance: RESCISSION, DENIAL, DECLINE, AND WAIVER OF ASSIGNMENT
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11664158
Filing Dt:
01/02/2008
Publication #:
Pub Dt:
08/28/2008
Title:
Silicon Substrate Processing Method
Assignor
1
Exec Dt:
03/09/2009
Assignee
1
B-6 MEZON TAKEUCHI 2, 341, KOMATSU
HAMAKITA-KU, HAMAMATSU-SHI, SHIZUOKA, JAPAN 434-0042
Correspondence name and address
CROWELL & MORING LLP
P.O. BOX 14300
WASHINGTON, DC 20044-4300

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