Patent Assignment Details
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Reel/Frame: | 022717/0524 | |
| Pages: | 2 |
| | Recorded: | 05/21/2009 | | |
Attorney Dkt #: | 105290.61524US |
Conveyance: | RESCISSION, DENIAL, DECLINE, AND WAIVER OF ASSIGNMENT |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11664158
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Filing Dt:
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01/02/2008
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Publication #:
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Pub Dt:
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08/28/2008
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Title:
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Silicon Substrate Processing Method
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Assignee
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B-6 MEZON TAKEUCHI 2, 341, KOMATSU |
HAMAKITA-KU, HAMAMATSU-SHI, SHIZUOKA, JAPAN 434-0042 |
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Correspondence name and address
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CROWELL & MORING LLP
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P.O. BOX 14300
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WASHINGTON, DC 20044-4300
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