Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 046478/0524 | |
| Pages: | 8 |
| | Recorded: | 05/01/2018 | | |
| Conveyance: | SECURITY AGREEMENT |
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Total properties:
3
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Patent #:
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Issue Dt:
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06/26/2001
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Application #:
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09526641
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Filing Dt:
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03/16/2000
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Title:
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Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds
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Patent #:
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Issue Dt:
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04/02/2002
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Application #:
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09879327
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Filing Dt:
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06/12/2001
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Publication #:
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Pub Dt:
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01/17/2002
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Title:
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Process of injection molding highly conductive molding compounds and an apparatus for this process
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Patent #:
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Issue Dt:
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04/25/2017
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Application #:
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14247111
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Filing Dt:
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04/07/2014
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Publication #:
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Pub Dt:
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10/08/2015
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Title:
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MULTI-PIECE MOLDED COMPOSITE MANDREL AND METHODS OF MANUFACTURING
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Assignee
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| 10 SOUTH DEARBORN, FLOOR L2, IL1-1145 |
| CHICAGO, ILLINOIS 60603 |
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Correspondence name and address
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CT CORPORATION
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4400 EASTON COMMONS WAY
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SUITE 125
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COLUMBUS, OH 43219
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