Patent Assignment Details
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| Reel/Frame: | 017415/0525 | |
| Pages: | 4 |
| | Recorded: | 12/22/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/28/2008
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Application #:
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11317978
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Filing Dt:
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12/22/2005
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Publication #:
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Pub Dt:
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04/12/2007
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Title:
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FLEXIBLE SUBSTRATE FOR PACKAGE OF DIE
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Assignees
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| NO. 1, YANFA 1ST RD. |
| HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN 300, R.O.C. |
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON, BERMUDA HM12 |
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Correspondence name and address
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ANDREW D. FORTNEY, PH.D.
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THE LAW OFFICES OF
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ANDREW D. FORTNEY PH.D., P.C.
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7257 N. MAPLE AVE., SUITE 107
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FRESNO, CA 93720
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