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Total properties:
12
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Patent #:
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Issue Dt:
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09/28/2004
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Application #:
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09440595
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Filing Dt:
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11/15/1999
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Publication #:
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Pub Dt:
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06/27/2002
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Title:
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MULTIPLE SEMICONDUCTOR CHIP (MULTI-CHIP) MODULE FOR USE IN HIGH-POWER APPLICATIONS
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Patent #:
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Issue Dt:
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04/22/2003
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Application #:
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09649673
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Filing Dt:
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08/28/2000
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Title:
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DATA CARRIER WITH AN INTEGRATED ELECTRONIC COMPONENT AND WITH A TRANSMISSION COLL WHICH COMPRISES TURN PORTIONS ARRANGED DIRECTLY AGAINST SAID COMPONENT
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Patent #:
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Issue Dt:
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04/12/2005
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Application #:
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09829797
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Filing Dt:
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04/10/2001
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Publication #:
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Pub Dt:
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11/29/2001
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Title:
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SEMICONDUCTOR DEVICE WITH ISOLATED INTERMETAL DIELECTRICS
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Patent #:
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Issue Dt:
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11/18/2003
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Application #:
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09884223
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Filing Dt:
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06/19/2001
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Publication #:
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Pub Dt:
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12/19/2002
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Title:
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SEMICONDUCTOR MODULE HAVING MULTIPLE SEMICONDUCTOR CHIPS
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Patent #:
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Issue Dt:
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01/20/2004
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Application #:
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09915677
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Filing Dt:
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07/26/2001
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Publication #:
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Pub Dt:
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03/28/2002
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Title:
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SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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11/04/2003
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Application #:
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09973317
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Filing Dt:
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10/09/2001
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Publication #:
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Pub Dt:
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06/20/2002
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Title:
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MODULE HAVING A LEAD FRAME EQUIPPED WITH COMPONENTS ON BOTH SIDES
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Patent #:
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Issue Dt:
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08/17/2004
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Application #:
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10005689
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Filing Dt:
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11/08/2001
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Publication #:
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Pub Dt:
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05/08/2003
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Title:
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CHIP-MOUNTED CONTACT SPRINGS
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Patent #:
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Issue Dt:
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09/09/2003
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Application #:
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10015720
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Filing Dt:
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11/30/2001
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Publication #:
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Pub Dt:
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07/04/2002
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Title:
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ASSEMBLY WITH CONNECTING STRUCTURE
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Patent #:
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Issue Dt:
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02/08/2005
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Application #:
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10282450
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Filing Dt:
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10/29/2002
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Publication #:
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Pub Dt:
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04/29/2004
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Title:
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JUNCTION TEMPERATURES MEASUREMENTS IN SEMICONDUCTOR CHIP PACKAGE TECHNOLOGY
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Patent #:
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Issue Dt:
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07/19/2005
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Application #:
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10301200
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Filing Dt:
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11/21/2002
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Publication #:
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Pub Dt:
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05/29/2003
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Title:
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MULTI-CHIP MODULE SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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04/18/2006
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Application #:
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10492120
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Filing Dt:
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10/11/2004
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Publication #:
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Pub Dt:
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03/24/2005
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Title:
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ELECTRICAL OR ELECTRONIC COMPONENT AND METHOD OF PRODUCING SAME
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Patent #:
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Issue Dt:
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03/28/2006
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Application #:
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10504752
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Filing Dt:
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08/17/2004
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Publication #:
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Pub Dt:
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06/02/2005
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Title:
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DEVICE FOR FORMING CONNECTION ELEMENTS
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