Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 013333/0528 | |
| Pages: | 6 |
| | Recorded: | 01/07/2003 | | |
| Conveyance: | RELEASE OF SECURITY INTEREST RECORDED ON 09/19/2001 AT REEL/FRAME 012153/0627 |
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Total properties:
3
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Patent #:
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Issue Dt:
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07/25/2000
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Application #:
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09055193
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Filing Dt:
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04/04/1998
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Title:
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HIGH-DENSITY COMPUTER MODULES WITH DOUBLE-LAYER PACKAGING
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Patent #:
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Issue Dt:
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12/12/2000
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Application #:
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09207490
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Filing Dt:
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12/08/1998
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Title:
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MULTI-CHIP PACKAGE WITH STACKED CHIPS AND INTERCONNECT BUMPS
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Patent #:
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Issue Dt:
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04/24/2001
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Application #:
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09228867
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Filing Dt:
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01/12/1999
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Title:
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HIGH-DENSITY COMPUTER MODULE WITH STACKED PARALLEL-PLANE PACKAGING
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Assignee
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| 30200 AVENIDA DE LAS BANDERAS |
| RANCHO SANTA MARGARITA, CALIFORNIA 92688 |
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Correspondence name and address
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WILSON, SONSINI, GOODRICH ET AL
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NANCY BOUCH
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650 PAGE MILL ROAD
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PALO ALTO, CA 94304
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