Patent Assignment Details
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Reel/Frame: | 050244/0528 | |
| Pages: | 2 |
| | Recorded: | 08/30/2019 | | |
Attorney Dkt #: | JIAQ 19.01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16490245
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Filing Dt:
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08/30/2019
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Publication #:
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Pub Dt:
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01/09/2020
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Title:
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Method and Device for Manufacturing Dissolving Microneedle
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Assignee
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9B, BUILDING 4, CEC HIGH-TECH INDUSTRIAL PARK, NO. 1, KEJI 7TH RD., TANGJIAWAN TOWN, HIGH-TECH DISTRICT, |
ZHUHAI, GUANGDONG, CHINA 519000 |
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Correspondence name and address
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HAYES SOLOWAY PC
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175 CANAL STREET
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5TH FLOOR
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MANCHESTER, NH 03101
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06/24/2024 04:19 AM
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