Patent Assignment Details
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| Reel/Frame: | 030736/0529 | |
| Pages: | 9 |
| | Recorded: | 07/03/2013 | | |
| Attorney Dkt #: | 27-886 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/20/2015
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Application #:
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13934797
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Filing Dt:
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07/03/2013
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRENCHED LEADFRAME AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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ISHIMARU & ASSOCIATES LLP
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2055 GATEWAY PLACE
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SUITE 700
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SAN JOSE, CA 95110
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