Patent Assignment Details
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Reel/Frame: | 006427/0530 | |
| Pages: | 2 |
| | Recorded: | 02/09/1993 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/05/1993
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Application #:
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08015473
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Filing Dt:
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02/09/1993
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Title:
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METHOD OF BONDING SEMICONDUCTOR CHIPS TO A SUBSTRATE
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Assignee
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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WILLIAM H. MURRAY, ESQ.
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SCHNADER, HARRISON, SEGAL & LEWIS
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SUITE 3600
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1600 MARKET STREET
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PHILADELPHIA, PA. 19103
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