Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 020900/0531 | |
| Pages: | 2 |
| | Recorded: | 05/05/2008 | | |
| Attorney Dkt #: | 4700.P0348US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/25/2011
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Application #:
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11795355
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Filing Dt:
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07/13/2007
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Publication #:
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Pub Dt:
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06/12/2008
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Title:
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RESIN SUBSTRATE MATERIAL, ELECTRONIC COMPONENT SUBSTRATE MATERIAL MANUFACTURED BY ELECTROLESS PLATING ON THE SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT SUBSTRATE MATERIAL
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Assignee
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| 10-1, TORANOMON 2-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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Correspondence name and address
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TERRYENCE F. CHAPMAN
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2026 RAMBLING ROAD
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KALAMAZOO, MI 49008-1631
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