Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 061374/0532 | |
| Pages: | 3 |
| | Recorded: | 10/11/2022 | | |
| Attorney Dkt #: | S355.0002US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/07/2023
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Application #:
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17286942
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Filing Dt:
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04/20/2021
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Publication #:
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Pub Dt:
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12/23/2021
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Title:
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Complex copper alloy including high-entropy alloy and method of manufacturing same
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Assignee
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| 23, PYEONGHWA-RO 2862BEON-GIL |
| DONGDUCHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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AMANDA M. PROSE
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121 SOUTH EIGHTH STREET, SUITE 1100
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WESTMAN, CHAMPLIN & KOEHLER, P.A.
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MINNEAPOLIS, MN 55402
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09/22/2024 06:41 AM
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