Patent Assignment Details
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| Reel/Frame: | 019124/0535 | |
| Pages: | 2 |
| | Recorded: | 04/04/2007 | | |
| Attorney Dkt #: | 130548 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11636623
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Filing Dt:
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12/11/2006
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Publication #:
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Pub Dt:
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06/12/2008
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Title:
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Method for improving the bonding properties of microstructured substrates, and devices prepared with this method
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Assignees
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| 26 RUE D'ULM |
| 75248 PARIS, FRANCE |
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| 3 RUE MICHEL ANGE |
| 75794 PARIS, FRANCE |
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| 27 RUE DU FAUBOURG SAINT JACQUES |
| 75014 PARIS, FRANCE |
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Correspondence name and address
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WILLIAM P. BERRIDGE
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OLIFF & BERRIDGE, PLC
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P.O. BOX 19928
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ALEXANDRIA, VA 22320
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