Patent Assignment Details
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Reel/Frame: | 022238/0539 | |
| Pages: | 3 |
| | Recorded: | 02/10/2009 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12367581
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Filing Dt:
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02/09/2009
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Publication #:
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Pub Dt:
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06/04/2009
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Title:
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Copper Alloy Sputtering Target and Semiconductor Element Wiring
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Assignee
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10-1, TORANOMON 2-CHOME |
MINATO-KU, TOKYO, JAPAN 105-8407 |
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Correspondence name and address
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HOWSON AND HOWSON
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SUITE 210, 501 OFFICE CENTER DRIVE
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FT. WASHINGTON, PA 19034
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