Patent Assignment Details
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Reel/Frame: | 004558/0540 | |
| Pages: | 1 |
| | Recorded: | 04/30/1986 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/26/1988
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Application #:
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06858135
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Filing Dt:
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04/30/1986
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Title:
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HYDRAULIC MANIFOLD FOR WATER COOLING OF MULTI-CHIP ELECTRIC MODULES
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Assignee
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A CORP OF NY. |
ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION
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INTELLECTUAL PROPERTY LAW DEPT.
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P.O. BOX 218
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YORKTOWN HEIGHTS NY 10598
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