Patent Assignment Details
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| Reel/Frame: | 027174/0540 | |
| Pages: | 2 |
| | Recorded: | 11/02/2011 | | |
| Attorney Dkt #: | 0271.1004 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/23/2016
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Application #:
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13318436
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Filing Dt:
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11/01/2011
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Publication #:
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Pub Dt:
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03/01/2012
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Title:
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ADHESIVE SHEET AND METHOD OF BACKGRINDING SEMICONDUCTOR WAFER
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Assignee
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| 1-1-, NIHONBASHI-MUROMACHI 2-CHOME |
| CHUO-KU, TOKYO 103-8338, JAPAN |
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Correspondence name and address
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STEIN MCEWEN, LLP
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ATTENTION: MICHAEL D. STEIN
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1400 EYE ST., N.W, SUITE 300
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WASHINGTON, D.C. 20005
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