Patent Assignment Details
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| Reel/Frame: | 013987/0548 | |
| Pages: | 3 |
| | Recorded: | 04/17/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10417705
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Filing Dt:
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04/17/2003
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Publication #:
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Pub Dt:
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10/21/2004
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Title:
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Method of fabricating an alloy cap layer over CU wires to improve electromigration performance of CU interconnects
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Assignee
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| 1551 MCCARTHY BLVD. |
| MILPITAS, CALIFORNIA 95035 |
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Correspondence name and address
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LSI LOGIC CORPORATION
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TIMOTHY R. CROLL
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1551 MCCARTHY BLVD.
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MILPITAS, CA 95035
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06/18/2024 05:49 PM
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