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Patent Assignment Details
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Reel/Frame:064069/0548   Pages: 4
Recorded: 06/27/2023
Attorney Dkt #:7017.379
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18214572
Filing Dt:
06/27/2023
Publication #:
Pub Dt:
01/11/2024
Title:
FLIP CHIP PACKAGE AND SUBSTRATE THEREOF
Assignors
1
Exec Dt:
06/21/2023
2
Exec Dt:
06/21/2023
3
Exec Dt:
06/21/2023
4
Exec Dt:
06/21/2023
5
Exec Dt:
06/21/2023
Assignee
1
NO.3, LIHSIN 5 RD., HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondence name and address
DEMIAN K. JACKSON
106 STARVALE LANE
SHIPMAN, VA 22971

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