Patent Assignment Details
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| Reel/Frame: | 064069/0548 | |
| Pages: | 4 |
| | Recorded: | 06/27/2023 | | |
| Attorney Dkt #: | 7017.379 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18214572
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Filing Dt:
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06/27/2023
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Publication #:
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Pub Dt:
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01/11/2024
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Title:
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FLIP CHIP PACKAGE AND SUBSTRATE THEREOF
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Assignee
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| NO.3, LIHSIN 5 RD., HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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DEMIAN K. JACKSON
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106 STARVALE LANE
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SHIPMAN, VA 22971
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Search Results as of:
06/16/2024 09:28 PM
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