Patent Assignment Details
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| Reel/Frame: | 067713/0549 | |
| Pages: | 5 |
| | Recorded: | 06/13/2024 | | |
| Attorney Dkt #: | I2000.300.101 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18388581
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Filing Dt:
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11/10/2023
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Publication #:
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Pub Dt:
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06/06/2024
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Title:
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CHIP PACKAGE AND METHOD INCLUDING ENCAPSULATING SPACED CHIPS BY LOCALLY CURABLE MATERIAL
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Assignee
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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STEVEN DICKE
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100 SOUTH FIFTH STREET
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SUITE 2250
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MINNEAPOLIS, MN 55402
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06/26/2024 07:26 PM
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