Patent Assignment Details
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Reel/Frame: | 006525/0550 | |
| Pages: | 4 |
| | Recorded: | 04/09/1993 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/17/1995
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Application #:
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08045398
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Filing Dt:
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04/09/1993
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Title:
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METHOD FOR REDUCING THE EFFECTS OF SEMICONDUCTOR SUBSTRATE DEFORMITIES
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Assignee
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2805 E. COLUMBIA ROAD |
BOISE, IDAHO 83706 |
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Correspondence name and address
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OZER M.N. TEITELBAUM
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MICRON SEMICONDUCTOR, INC.
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2805 E. COLUMBIA ROAD
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BOISE, ID 83706
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