Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 010766/0550 | |
| Pages: | 8 |
| | Recorded: | 04/19/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
6
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Patent #:
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Issue Dt:
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02/25/1986
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Application #:
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06495742
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Filing Dt:
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05/18/1983
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Title:
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ELECTRONIC ENCLOSURES HAVING METAL PARTS
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Patent #:
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Issue Dt:
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02/23/1988
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Application #:
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06555032
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Filing Dt:
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11/23/1983
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Title:
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HIGH DENSITY INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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08/29/1989
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Application #:
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07130469
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Filing Dt:
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12/09/1987
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Title:
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LOW COST, HERMETIC PIN GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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05/07/1991
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Application #:
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07373285
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Filing Dt:
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06/29/1989
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Title:
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GLASS BONDING METHOD
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Patent #:
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Issue Dt:
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01/14/1992
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Application #:
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07500693
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Filing Dt:
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03/28/1990
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Title:
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SEALING SYSTEM FOR HERMETIC MICROCHIP PACKAGES
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Patent #:
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Issue Dt:
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07/13/1993
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Application #:
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07747729
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Filing Dt:
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08/20/1991
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Title:
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CERAMIC PACKAGE AND METHOD FOR MAKING SAME
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Assignee
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| 10103 CARROLL CANYON ROAD |
| SAN DIEGO, CALIFORNIA 92131 |
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Correspondence name and address
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CHARMASSON & BUCHACA
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JOHN D. BUCHACA
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1545 HOTEL CIRCLE SOUTH
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SUITE 150
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SAN DIEGO, CA 92108-3412
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