Patent Assignment Details
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Reel/Frame: | 015125/0550 | |
| Pages: | 2 |
| | Recorded: | 03/22/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/27/2005
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Application #:
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10687626
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Filing Dt:
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10/20/2003
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Publication #:
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Pub Dt:
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07/15/2004
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Title:
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SOLDER PASTE PRINTING METHOD, SOLDER PASTE PRINTING APPARATUS, AND METHOD FOR MANUFACTURING A WIRING SUBSTRATE HAVING SOLDER-PRINTED LAYERS
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Assignee
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14-18, TAKATSUJI-CHO, MIZUHO-KU |
NAGOYA-SHI, AICHI, JAPAN |
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Correspondence name and address
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SUGHRUE MION, PLLC
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2100 PENNSYLVANIA AVENUE, N.W.
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SUITE 800
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WASHINGTON, DC 20037
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