Patent Assignment Details
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Reel/Frame: | 054032/0550 | |
| Pages: | 3 |
| | Recorded: | 10/13/2020 | | |
Attorney Dkt #: | EMEP0306USA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/31/2023
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Application #:
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17068836
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Filing Dt:
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10/13/2020
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Publication #:
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Pub Dt:
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04/15/2021
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND CAPABLE OF CONTROLLING THICKNESSES OF DIELECTRIC LAYERS
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Assignee
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ROOM 305, NO.47, PARK AVENUE II RD., HSINCHU SCIENCE PARK |
HSIN-CHU, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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06/25/2024 09:52 AM
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