Patent Assignment Details
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Reel/Frame: | 025615/0551 | |
| Pages: | 2 |
| | Recorded: | 12/22/2010 | | |
Attorney Dkt #: | 1938.1265 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/15/2013
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Application #:
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12926137
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Filing Dt:
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10/27/2010
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Publication #:
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Pub Dt:
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04/28/2011
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Title:
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FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignee
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314 MAETAN-3-DONG, YEONGTONG-GU |
SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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STAAS & HALSEY LLP
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ATTENTION: SANG CHUL KWON
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1201 NEW YORK AVE., N.W., 7TH FLOOR
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WASHINGTON, D.C. 20005
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