Patent Assignment Details
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| Reel/Frame: | 033264/0553 | |
| Pages: | 5 |
| | Recorded: | 07/01/2014 | | |
| Attorney Dkt #: | 9862-000589-US |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE INVENTORS NAME PREVIOUSLY RECORDED ON REEL 033027 FRAME 0955. ASSIGNOR(S) HEREBY CONFIRMS THE SPELLING OF THE INVENTORS NAME SHOULD BE LISTED AS LEE, YONG-KWAN.. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/26/2015
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Application #:
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14295577
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Filing Dt:
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06/04/2014
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Publication #:
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Pub Dt:
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12/11/2014
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
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Assignee
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| 129 SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 8910
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RESTON, VA 20195
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