Patent Assignment Details
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| Reel/Frame: | 015945/0554 | |
| Pages: | 4 |
| | Recorded: | 10/29/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10976376
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Filing Dt:
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10/29/2004
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Publication #:
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Pub Dt:
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05/04/2006
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Title:
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Methods to completely eliminate or significantly reduce defects in copper metallization in IC manufacturing
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Assignee
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| NO. 8, LI-HSIN ROAD 6 |
| SCIENCE BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN ROC 300-77 |
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Correspondence name and address
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DUANE MORRIS LLP
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HOWARD CHEN
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ONE MARKET STREET
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SPEAR TOWER, SUITE 2000
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SAN FRANCISCO, CA 94105-1104
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