Patent Assignment Details
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Reel/Frame: | 022386/0554 | |
| Pages: | 4 |
| | Recorded: | 03/12/2009 | | |
Attorney Dkt #: | P27327 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/22/2015
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Application #:
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12192679
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Filing Dt:
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08/15/2008
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Publication #:
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Pub Dt:
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02/18/2010
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Title:
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MICROELECTRONIC PACKAGE WITH HIGH TEMPERATURE THERMAL INTERFACE MATERIAL
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Assignee
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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INTEL CORPORATION
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C/O CPA GLOBAL
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PO BOX 52050
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MINNEAPOLIS, MN 55402
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