Patent Assignment Details
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Reel/Frame: | 058830/0554 | |
| Pages: | 8 |
| | Recorded: | 01/31/2022 | | |
Attorney Dkt #: | 100IM1104US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/05/2023
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Application #:
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17588134
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Filing Dt:
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01/28/2022
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Publication #:
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Pub Dt:
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08/04/2022
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Title:
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Method of deposition and method of fabricating electronic device using the same
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Assignees
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2091, GYEONGCHUNG-DAERO, BUBAL-EUP |
GYEONGGI-DO |
ICHEON, KOREA, REPUBLIC OF 17336 |
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55, HANYANGDAEHAK-RO, SANGROK-GU |
GYEONGGI-DO |
ANSAN, KOREA, REPUBLIC OF 15588 |
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Correspondence name and address
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AMPACC LAW GROUP
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6100 219TH ST SW #580,
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MOUNTLAKE TERRACE,, WA 98043
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