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Reel/Frame:058830/0554   Pages: 8
Recorded: 01/31/2022
Attorney Dkt #:100IM1104US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/05/2023
Application #:
17588134
Filing Dt:
01/28/2022
Publication #:
Pub Dt:
08/04/2022
Title:
Method of deposition and method of fabricating electronic device using the same
Assignors
1
Exec Dt:
01/17/2022
2
Exec Dt:
01/17/2022
3
Exec Dt:
01/17/2022
4
Exec Dt:
01/20/2022
5
Exec Dt:
01/17/2022
Assignees
1
2091, GYEONGCHUNG-DAERO, BUBAL-EUP
GYEONGGI-DO
ICHEON, KOREA, REPUBLIC OF 17336
2
55, HANYANGDAEHAK-RO, SANGROK-GU
GYEONGGI-DO
ANSAN, KOREA, REPUBLIC OF 15588
Correspondence name and address
AMPACC LAW GROUP
6100 219TH ST SW #580,
MOUNTLAKE TERRACE,, WA 98043

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