Patent Assignment Details
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Reel/Frame: | 063864/0554 | |
| Pages: | 10 |
| | Recorded: | 06/06/2023 | | |
Attorney Dkt #: | 249/1434_00 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18206201
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Filing Dt:
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06/06/2023
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Publication #:
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Pub Dt:
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02/15/2024
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES
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Assignee
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129, SAMSUNG-RO, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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Correspondence name and address
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EUGENE M LEE
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LEE IP LAW, P.C.
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3141 FAIRVIEW PARK DRIVE, SUITE 500
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FALLS CHURCH, VA 22042
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09/25/2024 03:30 AM
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