Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058408/0555 | |
| Pages: | 4 |
| | Recorded: | 12/16/2021 | | |
| Attorney Dkt #: | 110P001256US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/06/2024
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Application #:
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17552907
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Filing Dt:
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12/16/2021
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Publication #:
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Pub Dt:
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06/22/2023
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Title:
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ETCHING METHOD FOR MANUFACTURING SUBSTRATE STRUCTURE HAVING THICK ELECTRICALLY CONDUCTIVE LAYER, AND SUBSTRATE STRUCTURE HAVING THICK ELECTRICALLY CONDUCTIVE LAYER
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Assignee
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| 10F., NO. 455, SEC. 2, WENHUA 3RD RD., LINKOU DIST. |
| NEW TAIPEI CITY, TAIWAN 244 |
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Correspondence name and address
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
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3057 NUTLEY STREET
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SUITE 818
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FAIRFAX, VA 22031
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06/24/2024 06:44 AM
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