Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 067119/0556 | |
| Pages: | 6 |
| | Recorded: | 04/16/2024 | | |
| Attorney Dkt #: | ST PTE SG/STI (APPS) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18415231
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Filing Dt:
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01/17/2024
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Publication #:
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Pub Dt:
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08/29/2024
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Title:
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SUBSTRATELESS CHIP SCALE OPTICAL SENSOR PACKAGE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18428306
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Filing Dt:
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01/31/2024
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Publication #:
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Pub Dt:
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09/05/2024
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Title:
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SPLIT-GATE TRENCH POWER MOSFET WITH THICK POLY-TO-POLY ISOLATION
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18429009
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Filing Dt:
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01/31/2024
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Publication #:
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Pub Dt:
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10/03/2024
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Title:
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HYBRID QUAD FLAT NO-LEADS (QFN) INTEGRATED CIRCUIT PACKAGE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18441210
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Filing Dt:
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02/14/2024
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Publication #:
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Pub Dt:
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09/05/2024
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Title:
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HYBRID MULTI-DIE QFP-QFN PACKAGE
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Assignee
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| CHEMIN DU CHAMP-DES-FILLES |
| PLAN-LES-OUATES |
| GENEVA, SWITZERLAND 1228 |
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Correspondence name and address
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RAJ K. KRISHNAN
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STMICROELECTRONICS, INC.
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750 CANYON DRIVE, SUITE 300
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COPPELL, TX 75019
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