Patent Assignment Details
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Reel/Frame: | 017578/0557 | |
| Pages: | 4 |
| | Recorded: | 11/18/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/27/2009
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Application #:
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10536725
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Filing Dt:
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11/18/2005
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Publication #:
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Pub Dt:
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07/27/2006
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Title:
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METHOD AND DEVICE FOR MACHINING A WAFER, IN ADDITION TO A WAFER COMPRISING A SEPARATION LAYER AND A SUPPORT LAYER
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Assignee
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HANSASTR. 27C |
MUCHEN, GERMANY 80686 |
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Correspondence name and address
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ROYLANCE, ABRAMS, BERDO & GOODMAN, LLP
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1300 19TH STREET, N.W.
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SUITE 600
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WASHINGTON, D.C. 20036
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