Patent Assignment Details
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Reel/Frame: | 022591/0558 | |
| Pages: | 4 |
| | Recorded: | 04/24/2009 | | |
Attorney Dkt #: | JCLA27329 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12429476
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Filing Dt:
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04/24/2009
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Publication #:
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Pub Dt:
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11/12/2009
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Title:
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STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
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Assignee
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26, CHIN 3RD., 811, NANTZE EXPORT |
PROCESSING ZONE, KAOHSIUNG, TAIWAN R.O.C. |
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Correspondence name and address
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J. C. PATENTS
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4, VENTURE SUITE 250
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IRVINE, CA 92618
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