Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058784/0558 | |
| Pages: | 4 |
| | Recorded: | 01/27/2022 | | |
| Attorney Dkt #: | 108504-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17584391
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Filing Dt:
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01/26/2022
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Publication #:
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Pub Dt:
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08/11/2022
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Title:
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ELECTRONIC DEVICE WITH IMPROVED STRUCTURAL RELIABILITY INCLUDING ELECTRONIC COMPONENT AND DRIVING STRUCTURE COUPLED VIA CONDUCTOR LAYER
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Assignee
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| NO. 160 KESYUE RD., CHU-NAN SITE, HSINCHU SCIENCE PARK, CHU-NAN |
| MIAO-LI COUNTY, TAIWAN 35053 |
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Correspondence name and address
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JCIPRNET
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8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
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TAIPEI, 100404 TAIWAN
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