Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 051490/0561 | |
| Pages: | 8 |
| | Recorded: | 01/13/2020 | | |
| Attorney Dkt #: | AB3338-US 111079-250767 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/04/2021
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Application #:
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16384348
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Filing Dt:
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04/15/2019
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Publication #:
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Pub Dt:
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10/15/2020
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Title:
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STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
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Assignee
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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JUSTIN K. BRASK
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1211 SW 5TH AVENUE, STE. 1600
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PORTLAND, OR 97204
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