Patent Assignment Details
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Reel/Frame: | 038684/0563 | |
| Pages: | 5 |
| | Recorded: | 05/23/2016 | | |
Attorney Dkt #: | 03VV-191423 |
Conveyance: | SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/23/2018
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Application #:
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14927361
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Filing Dt:
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10/29/2015
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Publication #:
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Pub Dt:
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05/04/2017
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Title:
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Semiconductor Device and Method of Forming DCALGA Package Using Semiconductor Die with Micro Pillars
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Assignee
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660 S. FIGUEROA ST., SUITE 800 |
ATTN: SEMTECH RELATIONSHIP MANAGER |
LOS ANGELES, CALIFORNIA 90017 |
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Correspondence name and address
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SHEPPARD, MULLIN, RICHTER & HAMPTON LLP
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333 S. HOPE ST., 43RD FLOOR
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ATTN: J. CRAVITZ
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LOS ANGELES, CA 90071
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09/21/2024 06:38 PM
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